12 production and inspection machines, led by YAMAHA YRM20 placement platforms, in a high-grade dust-free cleanroom.
Click any card on the Factory or Home page to land here. Each machine below is part of the standard workflow we use for prototypes, NPI and volume PCBA.
The YAMAHA YRM20 is the high-speed modular mounter that anchors our SMT line. It handles large PCBs up to L 810 × W 742 mm, places components from 03015 micro-chips to large odd-form parts, and drives stable volume output with 98,000 CPH placement under optimal conditions.
The YAMAHA YSM20R is a high-end multi-functional mounter that balances speed and flexibility. With 140 feeder stations, 95,000 CPH best rate and ±0.035 mm accuracy, it is ideal for high-mix, medium-to-high volume automotive, industrial and consumer PCBA.
The YAMAHA YSM10 is a cost-optimized entry-level mounter that still covers a wide component range. It supports PCBs up to L 810 × W 742 mm (L 1,200 mm capable) and 03015 to 55 × 100 mm components, and combines 48 tape feeders with 15 tray feeders for flexible material supply.
The Huancheng cP500 fully automatic solder paste printer deposits paste with repeatable precision before component placement. It accepts a wide PCB size range, supports glue / red-adhesive printing, and runs under full automatic control to lift efficiency, lock down quality and reduce cost.
The HE-1000D is a dual-track 10-zone reflow oven with left-to-right conveyor transmission on fixed rails plus mesh belts. It accepts PCBs up to 680 mm wide, runs the two tracks at independent adjustable speeds, and holds temperature to ±0.1 °C with cross-board ΔT ±2 °C for stable lead-free joints.
The VCTA-D820 is a dual-track inline AOI with an intelligent rail design that docks seamlessly with dual-track reflow ovens or mounters — saving energy while keeping the line compact. Programs on the two tracks can be switched freely to match different products, and OCR / OCV character recognition catches wrong and reversed components before they reach reflow.
The VCTA-V860 is an inline 3D solder paste inspector built on a high-precision servo + ball-screw platform with 1 μm repeatability. A high-frame-rate industrial camera with a telecentric lens and tri-color light handles FPC warpage for true-color inspection; Gerber (RS274-D / X) and DXF files auto-create pad data, and reports export in HTML, Excel or image.
The ZHX A410 AOI is an industrial-grade optical inspection station powered by an Intel quad-core industrial PC and a 22-inch widescreen LCD. It learns OK samples to build standard images, auto-generates inspection frames by component shape, and locks the part with micron-level fine adjustment for fast graphical programming.
The FAI-JCX830 SMT smart first-article tester cuts first-article manpower and time by roughly half. A single operator runs LCR + optical checks, BOM and CAD coordinates auto-generate inspection programs, and the system delivers digital reports automatically — accurate, with no missed tests and no human error.
The HF-XC9100 combines an X-ray component counter with an X-ray inspector. It counts 7–17 inch tape, tray IC and loose parts — four reels or one 17-inch tray at a time — without unsealing reels, and the same X-ray penetrates hidden joints to surface BGA pad voids and bubbles as auto-generated data.
The Yuhang YH-MD-01 dry-ice cleaner blasts CO₂ pellets to strip solder paste, flux residue and dirt from stencils, fixtures and assembled PCBs. The process is non-contact, non-corrosive and PCB-safe, leaves no water or chemical residue, and lifts the quality of the finished board.
The baking oven pre-bakes both PCBs and components at 150 ± 5 °C for 1–2 hours to drive out absorbed moisture. Doing this before reflow prevents popcorning, delamination and other moisture-driven defects — a small step that protects MSL-sensitive parts on every build.
